5 Must-Have Features in a AF SERIES Flux Ovens

5 Must-Have Features in a AF SERIES Flux Ovens

When evaluating a flux oven for welding applications, it is essential to prioritize certain features that guarantee efficiency, precision, and durability. From temperature control to safety mechanisms, the quality of your flux oven can significantly affect your welding outcomes.

Overview of the X-Reflow306 LF

The X-Reflow306 is designed for high performance in prototyping, laboratory testing, heat-resistance testing, and low volume production. Enhanced by its large backlit LCD display, it offers easy setting checks through numerical values or graphs.

Innovative Heating Control

Independent control of front and rear heaters allows precise management of hot air temperature and time settings across five zones. Various profiles can be pre-set for different PCBs, providing flexibility essential for customized operations.

Advanced Monitoring Capabilities

The large inspection window allows for process monitoring using a microscope or camera system. The oven utilizes microprocessor-based control with closed-loop monitoring to provide absolute repeatability of temperature profiles. It can store up to 250 profiles in its memory.

Real-Time Display and PC Interface

The large backlit display shows temperatures and times or a temperature vs. time graph in real-time. It also has an interface for computer integration, enabling firmware upgrades and custom settings downloads via the X485-USB Converter.

Temperature Flexibility

Designed for precision, the unit's minimum temperature setting is lowered to 50°C, accommodating low-temperature solders and curing adhesives. High operating temperature reaches up to 350°C, suitable for lead-free soldering.

Compact Design and QoL Features

• Compact and lightweight design – weighs only 43kg and can fit on a desk.
• A large glass viewing window (280x280 mm) for easy inspection.
• Large backlit LCD display for easy program entry and verification, with adjustable contrast.
• Capability to store up to 250 programs.
• Independent control of front and rear heaters for unsymmetrical thermal loads.
• Profile led indicators for easy operation.
• Standard nitrogen connection to reduce lead and pad oxidation during soldering.
• Password protection for pre-programmed profiles.
• Sequencer mode for cycle temperature management in manufacturing.

Additional Features

At present, two external thermocouple inputs are located on the back panel for real-time board temperature monitoring via the X-306 Oven Monitor program.

High Operating Temperature

The unit offers an operating temperature higher than many other ovens at 350°C (662°F), ensuring robust performance with lead-free alloys.

High Performance in Small Size

The X-Reflow306 LF impresses with its high performance despite its compact size. It fits comfortably on a desktop, making it suitable for small spaces.

Advanced Cooling System

The model X-Reflow306 LF-AC features an advanced cooling system, rapidly cooling the soldered PCBs. This results in better reliability and handling safety for the operators.

Fume Extraction Management

This oven includes an intelligent fume extraction system that activates at the end of the reflow phase. This helps in maintaining air quality in small rooms and ensures efficient cooling of PCBs.

Technical Specifications

• Reflow area: 12"x12"x1.75" (305x305x45 mm)
• Temperature range: 70°C to 350°C
• Temperature Zones: Preheat1, Preheat2, Soak, Reflow, Cooling – total of 5 zones
• Heaters: 2 Heaters (Front and Rear) 2.4kW programmed independently
• Max. PCB size: 12"x12" (305x305 mm)
• Supply requirements: 21 amps, 230V 50/60 Hz (Max power consumption: 5 kW)
• Cooling cycle: Last (Fifth) Zone
• Monitoring window size: 9.84"x9.84" (280x280 mm)
• Nitrogen connection: Standard connector. Nitrogen pressure: 1/2-1 bar (7-14.5 psi)
• Size: L=30"xW=20"xH=12" (L=480mm x W=711mm x H=200mm)
• Weight (unpacked): 88 lbs. (40 kg)
• Computer profile control: Allows pre-programming, storage and recall of up to 250 programs
• Communication with PC: RS485 port (XKAR X485-USB converter required to connect to PC USB port)
• Advanced features: Display of actual temperature/time numerically or as a graph, independent offset for heaters, RS-485 port for firmware upgrades, ready for nitrogen environment, multiple process monitoring methods.

Additional Features:

X-306 Oven Monitor

Process Monitoring Software that shows graphs of temperature versus time on a PC or laptop. It reads front and rear thermocouples in the oven and up to two additional thermocouples connected by the operator. It can record, save, or print the profile of the soldered PCB using external "K" thermocouples.

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Advanced Cooling Hardware

The complete set of hardware and instructions are provided to convert the X-Reflow306 LF to X-Reflow LF-AC, enabling the cooling of PCBs to near room temperature in approximately 300 to 400 seconds.

X-306 Fume Extract

High Vacuum Fume Extraction Unit with HEPA Filtration for Batch Oven X-Reflow306. Powered from the back panel of the X-Reflow306 LF and X-Reflow306 LF-AC units. It is essential for extracting and cleaning fumes generated during soldering, especially in smaller rooms.

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